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WAFER LOADER
AL1100
ㆍ AL1100 Wafer Loader
AL1100 Wafer Loader
1. AL1100 is
Wafer Loader AL1100은 high-speed X-Y stage unit, Microscope unit, Auto focus unit, Macro inspection unit, high-speed safe wafer handling unit으로 구성되어 있습니다. 또한 아주 얇은wafer의 관찰이 가능합니다
미세한 단차의 edge부에서 되돌아온 산란 광만이 보임

2. AL1100 Outline
(1) 고속의 비접촉 센터링 (AL110)
(2) 연속 샘플링 검사, 샘플링 모드
(3) Top macro (mechanical JS +/- 30 degree, CW/CCW, 3-30 sec/R)
(4) Back macro (back center inspection 90-160 degrees 10 position)
(5) Micro inspection (MX61L, MX80)
(6) 고속의 모토라이징 스테이지 (200mm/Sec)
(7) 인체공학적 remote control (MSOPU)
AL1100 Wafer Loader

1. 스케닝 스테이지를 채택, 안전성 있는 웨이퍼 이송이 가능합니다.
(1) Inspection:

100% 전 영역 관찰, crossways 관찰, random 선택, die scan, step operation 등이 가능합니다.
Non-routine operation such as 4-direction key, JS, map click
(2) Display:

다양한 이미지의 관찰이 가능합니다.

Wafer map (full/enlarge display), die display



(3) 불량검사
255 defect patterns을 등록하여 구분할수 있습니다.
(4) 결과 display:
다양한 방법으로 결과를 표현할 수 있습니다.

Wafer quality , wafer defect map, p graph, bar chart and consolidated display

Operation

(1). Loader Operation
01. Loading Method
 : One Carrier, Return Mode
02. Pickup and Unloading Method
: All wafers, Selected wafers, Orientation Direction Setting for Unloading Wafers
: Wafer in Slot Search Function
(2). Macro Inspection Operation
01. Top Surface Macro
 : Inspection Duration ->0 to 9 sec. and infinite
: Rotation Direction, Rotation Speed Setting 3 to 30 sec./rotation
: Swing Movement Position can be manually set (Initial position can be set)
02. Back Surface Macro
 : Inspection Duration ? 0 to 9 sec. and infinite
: Tilting Angle 90 to 160 degrees with 10 steps (Initial angle can be set)
: Remote controllable from Operation Table
: Another Back Macro Inspection for entire area inspection
-> Once rotate the wafer and again tilt with holding different area on wafer back surface
(3). Microscope Stage Operation
01. Programmed Point Move
 : 10,000 points x 200 files maximum
(Coordinates input, Teaching, Automatic Generation)
: Select one of the saved files from recipe file
(The file selection can be changed during operation.)
: High speed stage travel with “Next Point” and “Previous Point” buttons on Operation Panel.
: Inspecting points over the wafer can be set as Main Program.
02. Scan Pattern Move
 : Any pattern for X and Y direction can be made. (200 max)
: Select one of the saved pattern files from recipe file
(The file selection can be changed during operation.)
: Operation will be carried out with “Start Scan/Stop”, and “End Scan” buttons on Operation panel.
03. Step Move
 : High-speed stage travel with the step distance set with recipe file for four-directions. (Minimum step with 1um)
04. Die Move
 : High-speed stage travel to the next Die for four-directions.
Die pitch can be set with recipe file.
05. Direct Move
 : High-speed stage travel to the appointed coordinate point from the keyboard. (Minimum step with 1um)
06. Clickable Map Move
 : Move to the clicked point on the clickable wafer map.